Emerging Paradigms and Architectures for Industry 4.0 Applications
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Emerging Paradigms and Architectures for Industry 4.0 ApplicationsData
2022Cita bibliográfica
Fraga-Lamas, P.; Lopes, S.I.; Fernández-Caramés, T.M. Emerging Paradigms and Architectures for Industry 4.0 Applications. Appl. Sci. 2022, 12, 9546. https://doi.org/10.3390/app12199546
Resumo
[Abstract]: The Fourth Industrial Revolution (4IR), called “Industry 4.0” in Europe, “Industrial Internet of Things” in North America, or “Made in China 2025” in China, blurs the boundaries between the physical, digital and biological worlds, paving the way to the continuous improvement of manufacturing processes. The 4IR-enabling technologies such as Industrial Cyber–Physical Systems (ICPS), Industrial Internet of Things (IIoT) technologies, novel
computing paradigms (e.g., fog, mist, and edge computing), Distributed Ledger Technologies (DLTs) (e.g., blockchain), digital twins, and augmented/mixed reality technologies,
enable novel cyber-secure, resilient, collaborative and human-centric advanced manufacturing systems. This Special Issue aims to report the latest breakthroughs in architectures, paradigms, and applications in the ever-increasing complex ecosystem of smart manufacturing. A total of eleven research papers were published in this Special Issue, approaching several fields of Industry 4.0 paradigm, such as Low-Power Wide-Area Network (LPWAN) technologies, additive manufacturing, energy harvesting, Industrial Internet of Things (IIoT), Cyber–Physical Systems (CPS), Artificial Intelligence (AI) or cybersecurity.
Palabras chave
Industry 4.0
Industrial Internet of Things (IIoT)
Cyber-Physical Systems (ICPS)
Distributed Ledger Technologies (DLTs)
Smart manufacturing
Cybersecurity
Industrial Internet of Things (IIoT)
Cyber-Physical Systems (ICPS)
Distributed Ledger Technologies (DLTs)
Smart manufacturing
Cybersecurity
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Dereitos
Atribución 3.0 España © 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
ISSN
2076-3417