The Robobo Project: Bringing Educational Robotics Closer to Real-World Applications
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The Robobo Project: Bringing Educational Robotics Closer to Real-World ApplicationsAutor(es)
Fecha
2018Cita bibliográfica
Bellas, F. et al. (2018). The Robobo Project: Bringing Educational Robotics Closer to Real-World Applications. In: Lepuschitz, W., Merdan, M., Koppensteiner, G., Balogh, R., Obdržálek, D. (eds) Robotics in Education. RiE 2017. Advances in Intelligent Systems and Computing, vol 630. Springer, Cham. https://doi.org/10.1007/978-3-319-62875-2_20
Resumen
[Abstract]: The Robobo Project is a STEM-based project that aims to bring educational robotics, in primary and high school, closer to real-world applications. It is based on the use of a smartphone-based robotic platform called Robobo, a very flexible programming environment, and a set of lessons to integrate them. The smartphone provides high-level hardware capabilities in terms of sensors, communications and processing capabilities that allow to create more practical and realistic lessons that exploit human-robot interaction, with a small investment. In this paper, we present the main elements of The Robobo Project in terms of hardware and software, and two illustrative educational projects that can be developed within it.
Palabras clave
Interactive education
Smartphones
Computer vision
Speech recognition
Real-World robotics
Smartphones
Computer vision
Speech recognition
Real-World robotics
Descripción
This version of the conference paper has been accepted for publication, after peer review and is subject to Springer Nature’s AM terms of use (https://www.springernature.com/gp/open-science/policies/accepted-manuscript-terms), but is not the Version of Record and does not reflect post-acceptance improvements, or any corrections. The Version of Record is available online at: https://doi.org/10.1007/978-3-319-62875-2_20.
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Derechos
©2018 Springer International Publishing AG. Subject to Springer Nature’s AM terms of use (https://www.springernature.com/gp/open-science/policies/accepted-manuscript-terms)
ISSN
2194-5357
ISBN
978-3-319-62874-5